发明名称 INSPECTION DEVICE OF IC WAFER
摘要 PROBLEM TO BE SOLVED: To cut grouping inspection and the number of lines by inserting a protective resistance of each IC chip to a branch line, which is branched from a signal main track connecting a probe device and a tester device body and is introduced to each IC chip inside each group. SOLUTION: A signal main track 8 connecting a probe device, which delivers a signal in contact with a group of an IC chip 7 on an IC wafer and a tester device body 1, is formed, and a protective resistance R is inserted to a branch line 9 which is branched from the signal main track 8 and introduced to each IC chip 7 inside each of groups G1 to Gn. An address signal from the tester device body 1 is made to flow to a common address signal main track 8a and the signal is applied to each IC chip 7 inside the group G via the branch line 9, an address is opened and an inspection signal is input to the address. Then a response signal to an inspection signal is input to the same branch line 9 and a common input/output signal main line 1, and inspection is executed.
申请公布号 JP2000332068(A) 申请公布日期 2000.11.30
申请号 JP19990137679 申请日期 1999.05.18
申请人 YAMAICHI ELECTRONICS CO LTD 发明人 SUZUKI NOBUSHI;ABE SHUNJI;IKEDA SHIGEO
分类号 H01L21/66;(IPC1-7):H01L21/66 主分类号 H01L21/66
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