| 摘要 |
PROBLEM TO BE SOLVED: To obtain a printed substrate which reduces a region required for part mounting by providing a pad which is shared or a through-hole. SOLUTION: The printed substrate is constituted of a pad 21 connected to a signal line 11, a pad 22 connected to a signal line 12 and a pad 23 connected to a signal line 13 and connects a chip-type resistor 51 by sharing the pad 23. That is, when the chip-type resistor 51 is connected between the pad 21 and the pad 23, the signal line 11 and the signal line 13 are electrically connected, and when the chip-type resistor 51 is connected between the pad 22 and the pad 23, the signal line 12 and the signal line 13 are electrically connected.
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