发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To enhance the breakdown voltage by a method wherein a groove entering into a stand-like part is provided so as to locate between mutual spaces of end regions of a plurality of electrodes. SOLUTION: A surface of a semiconductor substrate 1 has two source pad stand-like parts 22 and one drain pad stand-like part 23 in addition to a main operating region stand-like part 12. A structure of a semiconductor layer of these additional stand-like parts 22, 23 has the same structure as in the semiconductor layer of the main operating region stand-like part 12. The main operating region stand-like part 12 has a plurality of binding grooves in the outer margin. The groove 20 is entered into a source slit 2a and a drain slit 3a. Namely, a groove 20 is provided in an inlet-like manner in the island-like stand-like part 12, and an interval between the end part of the source slit part 2a and the drain slit part 3a is isolated by the groove 20.
申请公布号 JP2000332234(A) 申请公布日期 2000.11.30
申请号 JP19990138402 申请日期 1999.05.19
申请人 SANKEN ELECTRIC CO LTD 发明人 GOTO HIROICHI;IWAGAMI SHINICHI;ASAHARA YASUYUKI;CHINO EMIKO
分类号 H01L29/812;H01L21/338;H01L27/095;H01L29/778;(IPC1-7):H01L29/778 主分类号 H01L29/812
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