发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To increase dissipation efficiency of heat due to local current concentration. SOLUTION: A pair of pressure welding conductors 5, 6 are pressure-welded to a cathode electrode 2 and an anode electrode 3, which are connected with a semiconductor substrate 1. Around the cathode electrode 2, a gate electrode 4 is formed and covered with an insulating film 7, which is formed as a diamond film or a diamond-like carbon film of superior thermal conductivity.
申请公布号 JP2000332231(A) 申请公布日期 2000.11.30
申请号 JP19990138001 申请日期 1999.05.19
申请人 MITSUBISHI ELECTRIC CORP 发明人 HASE YUJI
分类号 H01L29/744;H01L29/74;(IPC1-7):H01L29/744 主分类号 H01L29/744
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