| 摘要 |
PROBLEM TO BE SOLVED: To obtain high mounting reliability in a mounting structure of electronic components and a method of mounting electronic components, whereby electronic components such as semiconductor packages are mounted on a circuit board for example printed wiring board, using a bond metal such as solder, even if this makes it a multi-terminal type. SOLUTION: In a mounting structure of electronic components, which is composed of a BGA package 10 having a plurality of solder bumps 20 provided in the form a grid array on a package body 13 lower surface, a QFP package 30 having leads 32 extending out from the package body 31 and a circuit board 15 with connection electrode 16 and bonds the bumps 20 and the leads 32 to the connection electrode 16 via solder paste 12, the m.p. of the solder bumps 20, is set lower than the bond temp. for soldering the leads 32 to the connection electrode 16 via the paste 21, and the heat resistance temp. of the QFP package 30 is set higher than the soldering temp. of the leads 32 to the connection electrodes 16 via the paste 21.
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