PHOTOCURING AND THERMOSETTING COMPOSITION

摘要

A halogen-free photocuring and thermosetting composition which does not generate harmful gases such as dioxin at burning and exhibits flame retardance and self extinguishing. This composition comprises (A) a resin compound prepared by reacting (a) a compound having two or more epoxy groups in the molecule with (b) an unsaturated monocarboxylic acid and (c) a compound represented by general formula (1) and then reacting the obtained product with a saturated or unsaturated polybasic acid anhydride, (B) a photopolymerization initiator, (C) a compound having two or more epoxy groups in the molecule, and (D) a reactive and/or nonreactive diluent. In formula (1) R1 and R2 are reach an cromatic ring or alkyl.