发明名称 ELECTRONIC COMPONENT BOARD MOUNTING SYSTEM
摘要 A system including post (30) and socket (32) elements for mounting an electronic component board (10) to a support structure (24), and a protective cover (50) for the electronic component board (10). In one embodiment, the electronic component board (10) comprises a power driver board having a plurality of socket elements (32) and the support structure includes a plurality of post elements (30). The socket elements (32) comprise an array of generally T-shaped openings in the power driver board, each having a stem portion (42) and a bridge portion (40). The post elements (30) comprise an array of generally planar projections normal to the support structure, each of the planar projections including a head portion (34) distal to the support structure. The post (30) and socket (32) elements are engageable in response to a first longitudinal motion and a second transverse motion of the electronic component board (10) relative to the support structure (24). The head portions (34) of the post elements (30) penetrate through the bridge portions (40) of the socket elements (32) in response to the first motion and the head portions overlie the stem portions of the socket elements in response to the second motion. The protective cover (50) comprises a lid (56) hingedly movable between raised and lowered positions, which lid (56) covers the electronic component board (10) when in the lowered position and provides access to the electronic component board when in the raised position.
申请公布号 WO0042828(A3) 申请公布日期 2000.11.30
申请号 WO2000US01276 申请日期 2000.01.14
申请人 WILLIAMS ELECTRONICS GAMES, INC. 发明人 PIOTROWSKI, PETER, J.;KRUTSCH, JOHN, R.
分类号 H05K7/14;(IPC1-7):A63D3/00;H05K5/00 主分类号 H05K7/14
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