发明名称 NEGATIVE RADIATION SENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a compsn. showing excellent property concerning to the dependence on coarse or fine patterns with which an excellent pattern form with high sensitivity and high resolution required for a photoresist for the production of a semiconductor and a liquid crystal display can be obtd., by incorporating a specified compd. into an epoxy resin and using a specified compd. as a radiation sensitive acid producing agent. SOLUTION: The compsn. contains an alkali soluble resin, a radiation sensitive acid producing agent and an epoxy resin. The epoxy resin contains epoxy compds. having four or more structural units of compds. expressed by formula I, and the radiation sensitive acid producing agent is a compd. expressed by formula II. In the formulae, each of R1 to R4 may be different and is a hydrogen atom, alkyl group, cycloalkyl group or the like, and the structural units of the compds. of formula I which may be different from others are bonded with at least one of the substituents, R5 is an allylene group, alkylene group or alkenylene group which may have substituents, and R6 is an alkyl group, aryl group, perfluoroalkyl group or the like which may have substituents.
申请公布号 JP2000330282(A) 申请公布日期 2000.11.30
申请号 JP19990142530 申请日期 1999.05.24
申请人 NAGASE DENSHI KAGAKU KK 发明人 IKEZAKI HIROTSUGU;KITANO KEI;KOTANI TAKESHI;ITO KUNIO
分类号 H01L21/027;C08K5/42;C08L63/00;C08L101/12;G03F7/004;G03F7/038 主分类号 H01L21/027
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