| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device by which a substrate can be dried, without making the substrate contaminated. SOLUTION: A method for manufacturing a semiconductor device by forming a thin film on a substrate 10, includes a cleaning process (1) of cleaning the substrate 10 with a cleaning solution, a liquid drain off step (2) of removing the cleaning solution adhering to the cleaned substrate 10, by blowing a compressed gas upon the substrate 10, and a film-forming step (3) of forming the thin film on the substrate 10 from which the cleaning solution is drained off.</p> |
