| 摘要 |
PROBLEM TO BE SOLVED: To surely remove a resist material without environmental aggravation by pasting an adhesive sheet on an upper surface of the resist material existing on a lifting face formed by photolithography and integrally stripping the resist material to form the lifting face. SOLUTION: The adhesive sheet is provided with a pressure sensitive adhesive layer having 20-150μm thickness on a film base material to be formed into a sheet or tape-shape. The film base material consists of plastic film having 10-1,000μm thickness consisting of polyester, polycarbonate, polyethylene, polypropylene, polyamide, acetylcellulose or the like. The pressure sensitive adhesive is a hardening type pressure sensitive adhesive consisting of acrylic polymer of acrylic ester, methacrylic acid, methacrylate ester or the like. At the time of removing the resist material, the pasted adhesive sheet is hardened with an ultraviolet ray and then stripped in a state that a slider substrate and the resist material is heated to 50-80 deg.C. |
