| 摘要 |
PROBLEM TO BE SOLVED: To exactly position a frame-like substrate on a metal frame by providing protrusions on the mounting frame, which contacts the frame inside a substrate or fits in holes of the frame for mounting the substrate on the metal frame by means of the protrusions. SOLUTION: This multiple connected semiconductor device comprises protrusions 1 on a metal frame 6, which contact the four corners of an inner frame of a frame-like substrate 5 for positioning the substrate 5. The protrusions 1 contacting the corners of the inner frame of the substrate 5 slope down to contact the top surface of the frame 6, so that the substrate 5 can be adhered with its center aligned with the center of a semiconductor chip 7 fixed previously to an exact position of the frame 6, or the substrate 5 is guided by the protrusions 1 to be positioned and adhered to an exact position on the frame 6, thereby mounting the semiconductor chip 7 in the frame of the substrate 5 on the precisely intermittently fed frame 6.
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