| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a compact pressure sensor module that can be manufactured easily and inexpensively and has large bending strength. SOLUTION: A lead frame 4 where a circuit part for composing a pressure sensor and an IC chip 3 (chip parts 8) for composing the circuit part of a non- contact data carrier are mounted is subjected to transfer forming by an epoxy resin or the like, thus manufacturing a resin forming body. At this time, a cavity 6 where a lead frame surface for mounting a pressure sensor chip 2 is exposed to a bottom surface is formed at a resin forming body 5. The pressure sensor chip 2 is mounted into the cavity 6, a pressure transferring resin 7 such as a silicone resin is filled into the cavity 6, and the pressure sensor chip 2 is sealed by the resin. Then, an unneeded lead frame part is cut for calibrating the pressure sensor, thus obtaining a pressure sensor module 1.</p> |
