| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer cleaning device which can ideally clean a wafer after the wafer is subjected to various kinds of treatments, such as copper plating, CMP after copper plating, etc. SOLUTION: A cleaning device clean the front and rear surfaces of a wafer W, while rotating the wafer W after the wafer W is subjected to prescribed working. The cleaning device is provided with cleaning nozzles 31 and 32 which respectively jet cleaning solutions (a) and (b) upon the worked surface and opposite surface of the wafer W and a nozzle 35 for etching which jets an etchant (c) upon the surface of the wafer W and is positioned near the outer peripheral section of the wafer W.
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