BURRLESS CASTELLATION VIA PROCESS AND PRODUCT FOR PLASTIC CHIP CARRIER

摘要

This invention incorporates a new process and structure for manufacturing castellation via in plastic chip carrier. It allows the creation of uniform side wall contacts in the shape of half-cylinders, devoid of any burrs and power dust particles, which when present in a plastic chip carrier, would prevent reliable electrical contacts by causing either short or open circuits. Thus the invention enables plastic chip carrier as a practical way of replacing traditional ceramic chip carriers.