CONDUCTIVE SHEET IN THICKNESS DIRECTION

摘要

PROBLEM TO BE SOLVED: To reliably make electric and mechanical connections in thickness of connections of a semiconductor chip and a substrate and obtain a conductive sheet having a high reliability in thickness after the connection. SOLUTION: Independent terminals 2 composed of conductors are arranged on one or both surfaces of a thermosetting insulation sheet 1 formed by irradiation with an active energy beam and the insulation sheet 1 is softened and melted in thermocompression bonding to a body 4 to be connected, thereby making the conductors pierce the insulation sheet 1 and heat setting to bond to the body 4 at the same time.