| 摘要 |
PROBLEM TO BE SOLVED: To enhance occupancy ratio of semiconductor elements to improve the packing density on a circuit board by placing an outer frame, an independently disposed package, terminals independently disposed inside the frame, and electrically insulative resin members interposed between them. SOLUTION: A circuit material 1 comprises an outer frame 2, a die pad 3 independently disposed inside the frame 2, a plurality of terminals 4 mutually independently disposed on approximately the same plane inside the frame 2, and electrically insulative resin members 5 interposed between the frame 2, the die pad 3 and each terminal 4. The die pad 3 is covered with the resin member 5 over half of the front surface 3A and with half of the back surface 3B exposed to the back surface of the circuit member 1. The terminals 4 have inner terminals 4A on the front surface and outer terminals 4B integrally on the back surface, and each inner terminal 4A is exposed so as to form a recess between the resin members 5. |
