发明名称 |
Chip-on-board (COB) assembly method for assembling electronic chips on circuit boards |
摘要 |
A chip-on-board (COB) assembly method for electronic chips being assembled on a PCB by contacting (4) the bonding wires (3) and by extensive adhesion of the housing. Part-adhesion of the chip (2) on the circuit board (1) is used in such a manner that the chip can be contacted and removed again without damage to the circuit board. Electronic testing or programming of the chip or module is carried out, as well as final complete adhesion of the chip using a procedure required for given chip functional capability and use of the circuit board.
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申请公布号 |
DE19921113(A1) |
申请公布日期 |
2000.11.30 |
申请号 |
DE1999121113 |
申请日期 |
1999.05.07 |
申请人 |
SIEMENS AG |
发明人 |
MUENCH, THOMAS;POHL, JENS;WUTZ, OLIVER |
分类号 |
H01L21/58;(IPC1-7):H05K3/32 |
主分类号 |
H01L21/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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