发明名称 Chip-on-board (COB) assembly method for assembling electronic chips on circuit boards
摘要 A chip-on-board (COB) assembly method for electronic chips being assembled on a PCB by contacting (4) the bonding wires (3) and by extensive adhesion of the housing. Part-adhesion of the chip (2) on the circuit board (1) is used in such a manner that the chip can be contacted and removed again without damage to the circuit board. Electronic testing or programming of the chip or module is carried out, as well as final complete adhesion of the chip using a procedure required for given chip functional capability and use of the circuit board.
申请公布号 DE19921113(A1) 申请公布日期 2000.11.30
申请号 DE1999121113 申请日期 1999.05.07
申请人 SIEMENS AG 发明人 MUENCH, THOMAS;POHL, JENS;WUTZ, OLIVER
分类号 H01L21/58;(IPC1-7):H05K3/32 主分类号 H01L21/58
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