| 摘要 |
The present invention provides a mounting structure for mounting an electrical device having terminal pins, capable of avoiding the breakage of solder joints joining the terminal pins to a conductive pattern of the printed wiring board even if the ambient temperature varies in a wide range, and of being fabricated without requiring increase in cost and additional components. A projection (3a) is formed by half-punching a printed wiring board (3). When mounting an electrical device (1) having terminal pins (2) on the printed wiring board (3), the electrical device (1) is put on the printed wiring board (3) with its bottom surface in contact with the projection (3a), and then the terminal pins (2) are soldered to a conductive pattern formed on the printed wiring board (3). Since a predetermined space (G) is formed between the bottom surface of the electrical device (1) and the surface of the printed wiring board (3), molten flux will not be caused to flow into the joint of the bottom surface of the electrical device (l) and the projection (3a) by capillarity. Since the contraction of the printed wiring board (3) is greater than that of the terminal pins (2) when the solder solidifies, a clearance is formed between the bottom surface of the electrical device (1) and the upper surface of the projection (3a). |
