SEMICONDUCTOR DEVICE

摘要

The present invention relates to a semiconductor device, and more particularly, it aims at providing a semiconductor device which is excellent in workability of assembly and reduces the assembly cost in a semiconductor device packaging a power device and a control device controlling this power device. In order to attain the aforementioned object, it shows a lead frame (10) before mounting a power devise (PD) and a control device (CD), and a region where a gold wire (W2) is arranged and a region where the power device (PD) is arranged are silver-plated regions (A). Further, a region where an aluminum wire (W1) is arranged is a nickel-plated region (B). Further, a power device die pad (1A) is connected to a tie bar (5) and a frame (6) by suspension leads (40 to 45), and supported in three directions. Further, an intermediate lead (3A to 3D) is formed in the vicinity of the control device (CD).