Core metal soldering knob flip-chip technology

摘要

PCT No. PCT/DE95/01589 Sec. 371 Date Aug. 4, 1997 Sec. 102(e) Date Aug. 4, 1997 PCT Filed Nov. 10, 1995 PCT Pub. No. WO96/16442 PCT Pub. Date May 30, 1996The invention relates to a solder bump of an inhomogeneous material composition for connecting contact pad metallizations of different electronic components or substrates in flip-chip technology, as well as to a method of making such a solder bump. A solder bump consists of a space defining high-melting solder bump core and a layer of a preferably low-melting solder material deposited thereon. The preconditions required for soldering, such as solder deposition, bump height and soldering temperature are thus all combined in the solder bump.