发明名称 Method of fabricating self-aligned capacitor
摘要 A method of fabricating a self-aligned capacitor of a DRAM cell is provided. First, a landing pad and a bit line are formed on a semiconductor substrate. An insulating layer is formed on the landing pad and the bit line. A photoresist layer is formed on the insulating layer and the pattern of the photoresist layer is transferred to the insulating layer. A via hole is formed in the insulating layer using the photoresist layer as a mask to expose the landing pad. Spacers are formed on the sidewalls of the via hole by deposition and self-align etching back. A conductive layer is formed in the via hole. The conductive layer on the insulating layer is removed to form a bottom electrode of a capacitor.
申请公布号 US6153513(A) 申请公布日期 2000.11.28
申请号 US19980164328 申请日期 1998.10.01
申请人 UNITED MICROELECTRONICS CORP. 发明人 LEE, HAL;LIANG, CHIA-WEN
分类号 H01L21/02;H01L21/3105;H01L21/8242;(IPC1-7):H01L21/824 主分类号 H01L21/02
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