发明名称 |
Method of fabricating self-aligned capacitor |
摘要 |
A method of fabricating a self-aligned capacitor of a DRAM cell is provided. First, a landing pad and a bit line are formed on a semiconductor substrate. An insulating layer is formed on the landing pad and the bit line. A photoresist layer is formed on the insulating layer and the pattern of the photoresist layer is transferred to the insulating layer. A via hole is formed in the insulating layer using the photoresist layer as a mask to expose the landing pad. Spacers are formed on the sidewalls of the via hole by deposition and self-align etching back. A conductive layer is formed in the via hole. The conductive layer on the insulating layer is removed to form a bottom electrode of a capacitor.
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申请公布号 |
US6153513(A) |
申请公布日期 |
2000.11.28 |
申请号 |
US19980164328 |
申请日期 |
1998.10.01 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
LEE, HAL;LIANG, CHIA-WEN |
分类号 |
H01L21/02;H01L21/3105;H01L21/8242;(IPC1-7):H01L21/824 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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