发明名称 BINDER COMPOSITION FOR MOLD
摘要 PROBLEM TO BE SOLVED: To provide inexpensive binder for a mold by using polyisocyanate containing no solvent component, while holding necessary characteristics for the mold, such as strength of mold, shelf life, usable time of the binder-coated sand. SOLUTION: This binder composition for mold is composed of phenol resin solution containing 1-20 wt.% alkylbenzene having 7.1-7.0 for SP value (solubility parameter) as the solvent component and the polyisocyanate containing at least two NCO radicals in the molecule which has no solvent component.
申请公布号 JP2000326049(A) 申请公布日期 2000.11.28
申请号 JP19990140637 申请日期 1999.05.20
申请人 SUMITOMO DUREZ CO LTD 发明人 KAMIMURA KATSUMI;IKEDA KAZUICHI
分类号 B22C1/22;C08G18/54;(IPC1-7):B22C1/22 主分类号 B22C1/22
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