| 摘要 |
PROBLEM TO BE SOLVED: To surely adsorb and separate a workpiece while keeping high uniformity in working by adding the pressure of the first fluid in an elastic bag to a semiconductor board, and sucking and retaining the semiconductor board by the second fluid in a fluid passage formed on a part opposite to the semiconductor board, of the bag. SOLUTION: In an apparatus where a wafer 1 is adsorbed and retained by a wafer retaining holder 3 and pressed to a grinding stone surface plate 20 to be ground, the wafer retaining holder 3 comprises a bag 22 made of a thin elastic body on a part of a holder board 21 to be rotated and driven, and the wafer 1 is statically pressed to the grinding stone surface plate 20 by the pressure of the air 23 supplied from the external. A flexible suction pipe 24 is penetrated inside of the bag 22, and its lower end part is opened at a position to be contacted with the wafer 1 at a lower surface of the bag 22 to be used as a suction nozzle 25, and the other end is connected to a suction source 26. Whereby the wafer 1 is surely adsorbed, and the error such as the separation of the wafer during the conveying of the wafer can be prevented. |
