| 摘要 |
PROBLEM TO BE SOLVED: To improve heat resistance and reliability as well as making adhesion and a cure of an adhesive for an electronic part at a relatively lower temperature by including a polyimide containing a piperazinylethylaminocarbonyl group and a compound containing a maleimide group. SOLUTION: An adhesive for an electronic part comprises compounding per 100 pts.wt. of a polyimide containing a piperazinylethylaminocarbonyl group in which a structural unit represented by formula I and a structural unit represented by formula II are arranged [in the formulas I and II, X is a direct bond, -O-, -SO-, -CO-, C(CH3)2-, -C(CF3)2-, and -COOCH2CH2OCO-; Ar is an aromatic group containing a piperazinylethylaminocarbonyl group represented by formulas III and IV; R is a 1-10C alkylene group or -CH2OC6H4- that a methylene group is bonded with Si; n is an integer of 1-20; Rp is a peperazinylethylaminocarbonyl group; R1 is a direct bond, -O-, -CO-, and -CH2-; and R2 is -CH2-, and -C(CH3)2-] and 10-900 pts.wt. of a compound containing at least two maleimide groups.
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