发明名称 THIN FILM FORMING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a thin film forming device capable of reducing stains in a chamber and controlling the distribution of the film thickness of a base material. SOLUTION: This thin film forming device is equipped with a chamber 1 which is an insulative body and has a means for exhausting its inside, an electroconductive substrate holder 3 provided in the chamber 1, a counter electrode 5 provided in the chamber 1, an evaporation source 20 for vaporizing a thin film forming material 8 provided in the chamber 1 and a high frequency electric source 15 for supplying high frequency electric power between the substrate holder 3 and the counter electrode 5 and making the vaporized thin film forming material 8 into plasma.
申请公布号 JP2000328239(A) 申请公布日期 2000.11.28
申请号 JP19990138661 申请日期 1999.05.19
申请人 SHIN MEIWA IND CO LTD 发明人 KATO KEIJI;TOKOMOTO ISAO;KOIZUMI YASUHIRO;YAMAGUCHI ASAKO;TAKIGAWA SHIRO
分类号 C23C14/32;(IPC1-7):C23C14/32 主分类号 C23C14/32
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