发明名称 |
Device for the application of joint material deposit |
摘要 |
PCT No. PCT/DE96/02078 Sec. 371 Date Jun. 15, 1998 Sec. 102(e) Date Jun. 15, 1998 PCT Filed Oct. 30, 1996 PCT Pub. No. WO97/17191 PCT Pub. Date May 15, 1997Device for the singled-out application of joining material deposits (30), particularly solder beads, from a joining material reservoir (11) with an application device (13) and a singling-out device (12) for singling-out joining material deposits from the joining material reservoir, wherein the singling-out device (12) is designed as a conveying device (20) for the singled-out transfer of joining material deposits (30) to the application device (13).
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申请公布号 |
US6152348(A) |
申请公布日期 |
2000.11.28 |
申请号 |
US19980068613 |
申请日期 |
1998.06.15 |
申请人 |
FINN, DAVID;RIETZLER, MANFRED |
发明人 |
FINN, DAVID;RIETZLER, MANFRED |
分类号 |
B23K1/005;B23K3/06;(IPC1-7):B23K1/00 |
主分类号 |
B23K1/005 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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