发明名称 MANUFACTURE OF SOLDER BALL AND MANUFACTURING DEVICE THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing solder balls capable of yielding solder balls of a desired diameter with an excellent yield, and a manufacturing device therefor. SOLUTION: In a manufacturing method (a manufacturing device) of solder balls in which a molten solder 5 is discharged from a tip of a nozzle 6 whose tip is immersed in the surface of an oil 2 into the oil heated to a temperature higher than the melting point of the solder, a liquid column 10 of the discharged molten solder is dropped downward in the oil while divided into pieces in the high temperature range of the oil heated to a temperature higher than the melting point of the solder and the liquid ball of the divided solder is solidified in a low temperature range in the oil adjacent to the lower part of the high temperature range in the oil to obtain the solder balls 8, the liquid column of the molten solder is divided into pieces by applying a vibration of >=400 Hz to <=1000 Hz in frequency to the molten solder discharged from the nozzle tip.
申请公布号 JP2000328112(A) 申请公布日期 2000.11.28
申请号 JP19990144106 申请日期 1999.05.24
申请人 SUMITOMO METAL MINING CO LTD 发明人 OKABE YOSHIHIRO;KAJIWARA MAKOTO;IMABAYASHI YASUKUNI
分类号 B23K35/40;B01J2/06;B01J2/18;B22F9/08;(IPC1-7):B22F9/08 主分类号 B23K35/40
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