发明名称 |
Flip-chip semiconductor device with enhanced reliability and manufacturing efficiency, and the method for under filling the same |
摘要 |
A flip-chip semiconductor device and a method for under filling the flip-chip semiconductor device are disclosed. The flip-chip semiconductor device is provided with a substrate and a die having a plurality of solder bumps for connecting to the substrate. Encapsulation material is under filled between the die and the substrate. The substrate has a non-mask area defied in a center portion thereof while the remaining surface area is covered by a solder mask. The non-mask area defines a hole in the center thereof so that the encapsulation material can be dispensed along all sides of the die to flow toward the non-mask area and stop when reaching the non-mask area whereby the encapsulation material does not block the hole and air between said die and the substrate is limited in a void formed around the hole and communicated with the atmosphere via the hole.
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申请公布号 |
US6153939(A) |
申请公布日期 |
2000.11.28 |
申请号 |
US19990317354 |
申请日期 |
1999.05.24 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
WANG, WEI-CHUNG;WANG, HSUEH-TE;FANG, JEN-KUANG;TAO, SU |
分类号 |
H01L21/56;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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