| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing a semiconductor excellent in flame-retardancy and storage safety, and a semiconductor device sealed with the composition. SOLUTION: A semiconductor element is sealed with a resin composition for sealing a semiconductor which comprises as an indispensable ingredient 100 pts.wt. of a thermosetting resin composition having incorporated therewith 200-1,200 pts.wt. of an inorganic filler, which thermosetting resin composition comprising a thermosetting resin having a dihydrobenzoxazine ring synthesized from phenols, formaldehydes and aromatic diamines selected from the group (A) below, an epoxy resin and a phenol resin, a mixture of these three ingredients having a melt viscosity of not higher than 2 P at 150 deg.C. (A): 4,4'- diaminodiphenylmethane, 4,4'-diaminodiphenyl ether, 1,3-bis(4-aminophenoxy) benzene,α,α'-bis(4-aminophenyl)-1,4-diisopropylbenzene.
|
