| 摘要 |
PROBLEM TO BE SOLVED: To provide an ink jet printer head having an ink supply groove and an ink supply hole shaped to be made efficiently, and a sand blasting method for silicon substrate. SOLUTION: In the first step, a first groove 38a of 100-200μm is made in a substrate 30 on a silicon wafer by scanning an abrasive grain jet nozzle 20 times repeatedly at a pitch equal to the width of the substrate 30 along the longitudinal direction of an ink supply groove 38. In the second step, the silicon wafer is turned over and an ink supply hole 39, having depth substantially equal to 1/2 of the thickness of the chip substrate 30, is made by scanning the abrasive grain jet nozzle 6 times repeatedly at a pitch equal to the length of the substrate 30 along the ink supply hole in the short side direction of the ink supply groove 38. In the third step, the silicon wafer is turned over again and a second groove 38b is made in the first groove 38a by scanning the abrasive grain jet nozzle 6 times repeatedly in the same direction at the same pitch as the second process along the part being conducted with the ink supply hole.
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