Method of cleaning a silicon wafer using a standard cleaning solution

摘要

A wafer cleaning process using standard cleaning 1 (SC1) solution includes a step of supplementing the cleaning solution with predetermined amounts of NH4OH and H2O2, or NH4OH, H2O2 and H2O during the cleaning of wafers with the solution so that a constant composition of the solution is maintained. After the cleaning solution is replaced with a fresh one, the solution is stabilized for a certain period of time to accomplish a complete mixing of the components therein. The present invention prolongs the useful life of standard cleaning solution and thus contributes to the efficiency of the cleaning process.