| 摘要 |
PROBLEM TO BE SOLVED: To certainly hold a semiconductor element with a simple and inexpensive structure and to improve usability in a wide range by a method wherein a plurality of pillar-like protuberances for engagement with the outer peripheral face of a semiconductor element are formed, being integral with a support surface of a flat tray for supporting the semiconductor element, so as to surround the semiconductor element. SOLUTION: For a tray 1, a flat support part 3 is formed all over the surface at the inside of a frame body 2, and a semiconductor element 5 is mounted on a support surface 3a demarcated on the support part 3. In this case, a plurality of pillar- like protuberances 7 are formed integrally at the support part 3 to surround and be engaged with each of the semiconductor elements 5. Then, each of the pillar-like protuberances 7 is formed entirely in a conical shape with its tip formed in a spherical surface. The similar pillar-like protuberances 8 are formed at the support surface 3b on the reverse side of the tray 1. Furthermore, the pillar-like protuberances 7 and 8 at the surface and the reverse side of the tray are provided, being offset from one another respectively at a specified angle around the center of each of the support surfaces 3a and 3b, so that the protuberances do not interfere with one another when the trays 1 are piled up. |
