发明名称 POLYIMIDE/METAL LAMINATE, SUBSTRATE FOR ELECTRIC/ ELECTRONIC EQUIPMENT, SUBSTRATE FOR MAGNETIC RECORDING, SUBSTRATE FOR SOLAR CELL, COATING FILM OF SPACE VOYAGE HARDWARE AND FILM-LIKE RESISTOR
摘要 PROBLEM TO BE SOLVED: To improve an adhesive strength after exposure with a high temperature and high humidity environment as an environmental resistance by laminating a polyimide film containing a titanium element and a metal layer in a polyimide/metal laminate. SOLUTION: The polyimide/metal laminate is obtained by directly laminating a metal layer on a polyimide film obtained by cyclodehydrating a polyamic acid containing a pyromellitic anhydride, 4,4-diaminodiphenylether as main components through an epoxy, nylon, acrylic, imide or their mixture adhesive by a method such as a vacuum vapor depositing method, a sputtering method, a wet plating method or the like. Thus, an electric equipment circuit can be operated without impairing a function even in a severe environment having a high temperature and a high humidity and excellent adhesive strength after exposure with the high temperature and high humidity as an environmental resistance.
申请公布号 JP2000326442(A) 申请公布日期 2000.11.28
申请号 JP20000067392 申请日期 2000.03.10
申请人 KANEGAFUCHI CHEM IND CO LTD 发明人 NISHINAKA MASARU;AKAHORI RENICHI
分类号 B32B15/088;B32B15/08;B32B27/34;G11B5/73;H01B17/62;H01L21/60;H05K1/03;H05K3/38;H05K3/46;(IPC1-7):B32B15/08 主分类号 B32B15/088
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