| 摘要 |
PROBLEM TO BE SOLVED: To provide a roughened surface-forming resin composition which does not cause the peeling of an interlayer resin insulation layer from a conductor circuit, can maintain a practical peeling strength, can prevent the generation of cracks, has good adhesivity to the lower conductor circuit, and can form via holes having diameters of <=75μm. SOLUTION: This resin composition for forming roughened surfaces is prepared by dispersing a substance soluble in a roughening liquid comprising at least one selected from acids, alkalis and oxidizing agents in a non-cured heat- resistant resin matrix slightly soluble in the roughening liquid comprising at least one selected from acids, alkalis and oxidizing agents. Therein, the heat- resistant resin matrix contains a (meth)acrylate ester monomer in an amount of 5 to 15 wt.% based on the whole solid content of the resin composition for forming roughened surfaces.
|
