发明名称 |
Process for producing multilayer printed circuit boards |
摘要 |
An etching solution comprising (A) an amine as a solvent, (B) an alkali metal compound, and (C) an alcohol as a solvent, this etching solution being a non-aqueous solution. This etching solution is-effective for etching a cured epoxy resin layer for forming holes for interstitial via holes having a small diameter, in the production of a multilayer printed circuit board. This etching solution is particularly effective for etching a cured epoxy resin layer formed from a thermosetting epoxy resin composition including (a) an epoxy resin, (b) a crosslinking agent, and (c) a polyfunctional epoxy resin, which forms a thermosetting copper-clad adhesive resin sheet which covers an interlayer circuit plate of a multilayer printed circuit board.
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申请公布号 |
US6153359(A) |
申请公布日期 |
2000.11.28 |
申请号 |
US19990275874 |
申请日期 |
1999.03.25 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
SHIMIZU, HIROSHI;OGAWA, NOBUYUKI;SHIBATA, KATSUJI;NAKASO, AKISHI |
分类号 |
C08J7/12;H05K3/46;(IPC1-7):H01L21/306;C23C3/002;B23F1/018 |
主分类号 |
C08J7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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