Method for creating a hermetic seal and package made thereby

摘要

A method for creating hermetic seals in semiconductor packages is provided. The method includes the applying a sealing glass to ceramic layers and placing a ceramic tape layer there between. The assemblage is then laminated and fired, or sintered, to marry the material layers together to form a hermetic seal. The hermetic seal made thereby may be incorporated into a wide variety of semiconductor devices including packages and feedthroughs.