Semiconductor packaging method

摘要

A container (10), which holds a molding material (12), is attached to a mold. The molding material passes from the container to the mold through an orifice (18) during the molding process. The container is gradiently heated with the hottest part of the container near the orifice, the heat gradually decreasing towards the opposite end of the container. The hotter molding material deforms faster than the cooler material and as the plastic is forced into the mold, the air escapes past the molding material along the container walls in the direction of the cooler material. A mechanism (16), preferably a narrow ram having a slightly conical shape (22), forces the molding material into the mold. The conical shape allows the air to pass by the mechanism out the end of the container opposite the orifice.