发明名称 |
Elimination of photo-induced electrochemical dissolution in chemical mechanical polishing |
摘要 |
Eliminating exposure of PN junctions to light capable of invoking a photovoltaic effect and/or inhibiting the oxidation and reduction reactions induced by the photovoltaic effect prevents the electrochemical dissolution of metal components on semiconductor devices by electrolysis. A darkened enclosure for use on tools for wafer CMP, brush cleaning, unloading, and rinsing will eliminate exposure. Alternatively, illumination of a semiconductor wafer can be limited to wavelengths of light that do not provide enough energy to induce a photovoltaic effect. An inhibitor in the CMP slurry and/or post-CMP water rinse blocks the oxidation and/or reduction reactions. A blocking agent, such as a high molecular weight surfactant, will interfere with both the oxidation and reduction reactions at the metal surface. Also, a poisoning agent will impede the reduction portion of electrolysis.
|
申请公布号 |
US6153043(A) |
申请公布日期 |
2000.11.28 |
申请号 |
US19980020010 |
申请日期 |
1998.02.06 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
EDELSTEIN, DANIEL C.;HORKANS, WILMA J.;LUCE, STEPHEN E.;LUSTIG, NAFTALI E.;POPE, KEITH R.;ROPER, PETER D. |
分类号 |
H01L21/304;B24B37/04;B24B49/12;H01L21/00;H01L21/02;H01L21/321;(IPC1-7):C23F1/02 |
主分类号 |
H01L21/304 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|