发明名称 Mechanical interface apparatus
摘要 A mechanical interface apparatus which is capable of loading semiconductor wafers stored in a sealed container into a processing apparatus without adversely affecting the surfaces of the semiconductor wafers due to exposure to external air or dust. When a sealed container 100 is placed on top of a processing apparatus 200, latch mechanisms 201 are activated to engage with a flange 103, so as to affix the container body 101. Then, valves 3 and 5 are opened to perform a gas purge, after which a drive mechanism provided inside a lock operating mechanism 220 is operated in order to withdraw lock arms 111 from concave portions 103a, thereby unlocking the bottom lid 110. Then, wafer cassettes 106 inside the container are lowered to a predetermined position by means of an in-apparatus elevator mechanism 202, and the wafer cassettes are loaded into the processing apparatus 200 by a cassette loading mechanism.
申请公布号 US6152669(A) 申请公布日期 2000.11.28
申请号 US19960747113 申请日期 1996.11.08
申请人 SHINKO ELECTRIC CO., LTD. 发明人 MORITA, TERUYA;MURATA, MASANAO;KAWANO, HITOSHI;TANAKA, TSUYOSHI;OYOBE, HIROYUKI;TAKAOKA, TOSHIYUKI
分类号 B65D85/86;H01L21/673;H01L21/677;(IPC1-7):B65G49/07 主分类号 B65D85/86
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