发明名称 MANUFACTURE FOR CUTTING CHIP
摘要 PROBLEM TO BE SOLVED: To extremely improve yield and largely decreasing manufacturing cost of chips by cutting a three-layer layered product in streaks, cutting many chip semi-finish products from the formed column-like material, and finishing these chip semi-finish products into the chips. SOLUTION: A three-layer layered product is cut vertically to the upper surface of a first layer 12 in the order of the first layer 12, a second layer 11, and a third layer 13, and thereby column-like materials 20 with rectangular cross section are produced. Then, by cutting this column-like material 20 from one cutting cross section 21 to the other cutting cross section 22, chip semi-finish products 30... including the second layer 11 at its center is produced. Then, cutting faces 41, cutting blades 42, and flanks 43 are formed on these chip semi-finish products 30... to form chips 40. Such manufacturing extremely improves product yield and allows inexpensive mass production of the chips 40.
申请公布号 JP2000326146(A) 申请公布日期 2000.11.28
申请号 JP19990143688 申请日期 1999.05.24
申请人 HONDA MOTOR CO LTD 发明人 HIROYASU MINORU;ISHIBASHI TOMOMI;ITO MASATOMI;NOMURA SUKEYUKI;NOMURA SHIGEMITSU;FUKUSHIMA HIROYUKI
分类号 B23P15/30;(IPC1-7):B23P15/30 主分类号 B23P15/30
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