发明名称 Method for heating exhaust gas in a substrate reactor
摘要 The present invention is a single wafer reactor having a vented lower liner for heating exhaust gas. The apparatus of the present invention includes a reaction chamber. A wafer support member which divides the chamber into an upper and lower portion is positioned within the chamber. A gas outlet for exhausting gas from the chamber has a vent to exhaust gas from the lower portion of the chamber and an exhaust passage opening to exhaust gas from the upper portion of the chamber. Heated inert purge gas is fed from the lower chamber portion through the vent at a rate so as to prevent the deposition gas from condensing in the exhaust passage.
申请公布号 US6153260(A) 申请公布日期 2000.11.28
申请号 US19970835955 申请日期 1997.04.11
申请人 APPLIED MATERIALS, INC. 发明人 COMITA, PAUL B.;CARLSON, DAVID K.;RILEY, NORMA B.;FAN, DORIA W.;RANGANATHAN, REKHA
分类号 C23C16/44;C23C16/455;C23C16/48;C30B25/14;C30B31/16;H01L21/205;(IPC1-7):C23C16/00 主分类号 C23C16/44
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