发明名称 APPARATUS FOR MOLDING SYNTHETIC RESIN SHEET
摘要 PROBLEM TO BE SOLVED: To prevent the lowering of the bonding strength of the respective layers of a synthetic resin sheet even if the thickness of the synthetic resin sheet becomes less than a predetermined thickness. SOLUTION: A molding apparatus has a pressure member 10, which protrudes toward the pressure holding surface 6b among the pressure holding surfaces 6b, 7b by a predetermined energizing force, provided in the pressure holding surface 7b. By this constitution, even if the thickness of a synthetic resin sheet 1 becomes less than a predetermined thickness, strong pressure can be applied to a plurality of layers by the pressure member 10 and the respective layers bite in mutually to obtain a sufficient bonding strength.
申请公布号 JP2000326396(A) 申请公布日期 2000.11.28
申请号 JP19990140312 申请日期 1999.05.20
申请人 MEIWA IND CO LTD 发明人 YUZAWA ICHIRO;HASEGAWA TAKAHIRO
分类号 B29C51/30;B29C33/76;(IPC1-7):B29C51/30 主分类号 B29C51/30
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