发明名称 |
ETCHING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE: An etching equipment for manufacturing a semiconductor device is provided to eliminate a partial stack of polymer and to prevent a particle from being generated from a shortage of thermal conduction of quartz parts. CONSTITUTION: An etching equipment for manufacturing a semiconductor device comprises an additional heat transfer material for heating parts of a quartz material facing an inner side of a process chamber(1). The additional heat transfer material is heated to heat the parts of a quartz material. And, the heat transfer material is a liquid material of which specific heat is higher than one, and is disposed in the manner that the material fills up a space formed inside the part of the quartz material.
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申请公布号 |
KR20000067614(A) |
申请公布日期 |
2000.11.25 |
申请号 |
KR19990015566 |
申请日期 |
1999.04.30 |
申请人 |
SAMSUNG ELECTRONICS CO, LTD. |
发明人 |
JUNG, GI SANG |
分类号 |
H01L21/306;(IPC1-7):H01L21/306 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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