发明名称 ETCHING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PURPOSE: An etching equipment for manufacturing a semiconductor device is provided to eliminate a partial stack of polymer and to prevent a particle from being generated from a shortage of thermal conduction of quartz parts. CONSTITUTION: An etching equipment for manufacturing a semiconductor device comprises an additional heat transfer material for heating parts of a quartz material facing an inner side of a process chamber(1). The additional heat transfer material is heated to heat the parts of a quartz material. And, the heat transfer material is a liquid material of which specific heat is higher than one, and is disposed in the manner that the material fills up a space formed inside the part of the quartz material.
申请公布号 KR20000067614(A) 申请公布日期 2000.11.25
申请号 KR19990015566 申请日期 1999.04.30
申请人 SAMSUNG ELECTRONICS CO, LTD. 发明人 JUNG, GI SANG
分类号 H01L21/306;(IPC1-7):H01L21/306 主分类号 H01L21/306
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