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发明名称
RESIN SEALING METHOD OF SEMICONDUCTOR CHIP AND RELEASE FILM USED THEREFOR
摘要
申请公布号
KR20000071391(A)
申请公布日期
2000.11.25
申请号
KR1020000009797
申请日期
2000.02.28
申请人
发明人
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主分类号
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