| 摘要 |
PROBLEM TO BE SOLVED: To simplify fix in a circuit board. SOLUTION: In a structure having a chassis 2 with a through-window 2a opened in front and rear surfaces of a chassis and an MIC(microwave integrated circuit) substrate 3 whereon an electronic part 6 with a package with a lead 6b inserted through the through-window 2a of the chassis 2 is mounted, the MIC substrate 3 is fixed to a rear of the chassis 2. A part keep part 4 is held through a package 6a of an electronic part 6 in a front opening circumferential edge of the through-window 2a and a fixing piece 5 with a hook 5a fixing a rear of the MIC substrate 3 is held to the part keep part 4. The fixing piece 4 is energized by a leaf spring 5b to a rear of the chassis 2 in a direction to press the MIC substrate 3.
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