发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To enhance positioning accuracy for trimming by a method wherein a fuse element for laser trimming, a pattern for laser trimming positioning, a complete depletion high-speed MOS transistor, a high breakdown-strength MOS transistor, an ESD protective element and a bleeder resistor, are installed. SOLUTION: A fuse element 31 for laser trimming, a pattern 610 for laser trimming positioning, a complete depletion high-speed MOS transistor 210, a high breakdown-strength MOS transistor, an ESD protective element 310 and a bleeder resistance 410, are installed in a semiconductor integrated circuit. The pattern 610 for laser trimming positioning is composed of a high light reflectance region and a low light reflectance region. The high light reflectance region is formed of a high light reflectance film which is formed on a flat substrate. The low light reflectance region is formed of a high light reflectance film which is constituted of the same thin film as the fuse element 31, and which is formed on a pattern such as a lattice or the like for light diffused reflection.
申请公布号 JP2000323655(A) 申请公布日期 2000.11.24
申请号 JP19990127028 申请日期 1999.05.07
申请人 SEIKO INSTRUMENTS INC 发明人 TAKASU HIROAKI
分类号 H01L27/04;H01L21/82;H01L21/822;H01L21/8234;H01L23/525;H01L27/01;H01L27/02;H01L27/06;H01L27/08;H01L27/12;H01L29/786;(IPC1-7):H01L27/04 主分类号 H01L27/04
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