| 摘要 |
PROBLEM TO BE SOLVED: To transfer conductive terminals onto electrodes on a semiconductor chip without positional slippage by forming the conductive terminals on a bump transfer sheet at positions that are corrected so as to adapt to the temperature of the transfer. SOLUTION: After a metal foil 6 is laminated on a base resin 2 by hot pressing, a reinforcing plate 30 is laminated on a surface, not in contact with the metal foil 6, of the base resin 2. Further, an etching mask 7 is formed on the metal foil 6, and the metal foil 6 is etched to form metal cores 4. Then, the etching mask 7 is removed, and a solder coat 5 is formed on each surface of t he metal cores 4 by electrodes plating to constitute conductive terminals 3 on a bump transfer sheet 1. The conductive terminals 3 are arranged at positions corrected in consideration of temperature difference between room temperature and the temperature of the heat transfer and difference of thermal- expansion coefficient between the semiconductor chip and the bump transfer sheet 1. |
