| 摘要 |
PROBLEM TO BE SOLVED: To obtain a structure of a bonding member for surface mounting which improves thermal stress resistance and has superior mechanical and electrical bonding properties by absorbing repeating stresses due to thermal cyclings applied to an electron device, which is formed by bonding an electronic component and a mounting substrate, between both of which thermal expansion coefficient difference exists. SOLUTION: This bonding member 10 for surface mounting is composed of a kneaded paste of a mixture of a viscous flux 13, a solder powder 11 and a heat-resistant soft resin 12. The bonding member 10 of this composition for surface mounting is heated to vaporize the viscous flux 13 and to perform mounting by forming a cellular flux solder metal which is formed by dispersing the heat-resistant soft resin in the solder metal formed by melting the solder powder. Thereby, the bonding member 10 functions as a stress-relaxing bonding member, that absorbs repeating stresses caused by the difference in thermal expansion coefficient between the electronic component and the mounting substrate.
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