| 摘要 |
PROBLEM TO BE SOLVED: To eliminate a metallic cover and to improve sensing accuracy in a simple structure, by applying plating for electromagnetic shield to the inner surface portion or the outer surface portion other than a land extending from the bottom of a recessed part to the outer surface, for electrically interconnecting a photosensitive elements, and providing an optically functioning aperture in the bottom of the recessed part of an injection molding component. SOLUTION: In a light receiving element package 10, a metallic cover for shielding electromagnetic noise is eliminated, and an electric black box structure where an MID (injection molding circuit component) package structure shields a photoelectric element 40 from external electromagnetic wave is employed, an aperture 21 is opened in a printed wiring board 20, and a relative position between the aperture 21 and the photoelectric element 40 is controllable with high accuracy. An MID 30 is injection-molded in a desired configuration having a recessed part for mounting the photoelectric element 40. A land pattern 31 electrically joined to a joining wire 41 of the photoelectric element 40 is formed on the inner surface of the MID 30 with plating treatment, and a circuit pattern 32 is formed on the outer surface with plating treatment.
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