发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To expand the band of an on-chip source-follower amplifier so as not to become a load capacitive when a semiconductor device is operated, by a structure wherein, when the semiconductor device is not mounted, a protective circuit is connected, and the protective circuit is not connected when the semiconductor device is mounted. SOLUTION: Both ends of a protective circuit element 3 are annularly formed. The protective circuit element 3 and a ground terminal 5 are connected. The protective circuit element 103 is insulated from an output terminal 4. An insulating part 6 is formed in the upper part of the output terminal 4. The protective circuit element 3 is made elastic. Usually, the output terminal 4 is brought electrically into contact with the terminal of the protective circuit element 103. When a package 1 is inserted into a socket, the protective circuit element 3 is pressed, the terminal of the protective circuit element 3 reaches the insulating part 6 in the output terminal 4, and the output terminal 4 is not brought electrically into contact with the terminal of the protective circuit element 3. When the package 1 is removed from the socket, the output terminal 4 is brought electrically into contact with the terminal of the protective circuit element 3 because the protective circuit element 3 is elastic.
申请公布号 JP2000323648(A) 申请公布日期 2000.11.24
申请号 JP19990131831 申请日期 1999.05.12
申请人 NEC CORP 发明人 NAKANO TAKASHI
分类号 H01L23/60;H01L25/10;H01L25/18;H01L27/14;H04N5/335;H04N5/355;H04N5/369;H04N5/372;(IPC1-7):H01L25/10 主分类号 H01L23/60
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